San Diego Joint Chapters
June 29th Lunch Meeting
Kyocera America, Inc.
Sponsored by
Torrey Hills Technology
Tuesday June 29,
2010 at 12:00 Noon
Please join us for a
technical presentation & lunch.
Program Description: Material
Trade-offs in Designing Electronic Packages
Material selections for high frequency applications in transmit/receive
(T/R) modules used in modern phased array radar systems is crucial to
military programs in terms of cost and performance. Module design
approach and fabrication methods are also taken into consideration to
minimize yield loss in manufacturing. HTCC, LTCC, and organic material
comparisons will be presented along with a case study describing the T/R
module design process using advanced modeling and simulation tools.
About this Speaker:
Paul Garland received his BS is System Science from the University of
California San Diego and has over 20 years experience in building and
designing electronic packages. He has worked at Kyocera since 1984 and
has had a variety of responsibility from manufacturing to R&D. In
1994, he helped begin the High Frequency Department and he is now a part
of the New Product Development Department where he specializes in high
speed and high frequency packaging. He has several patents related to
the packaging field and is currently the Vice Chair of the MTT-12 group.
Logistics:
Tuesday June 29, 2010 Starting at 12:00 PM - Lunch catered by Boston
Market
Kyocera America, Inc
8611 Balboa Ave
San Diego, Ca. 92123
It is recommended cameras and any recording devices be left in your car.
Program Cost:
$20.00for RSVP'd IMAP, ACerSMembers.
$25.00 for all others.
Complimentary for students with ID
To register, please contact Dave Virissimo of Semiconductor Packaging
Materials at dvirissimo@sempck.com or 619-464-5430
or purchase directly through Paypal below.
