Summer Social at the Del Mar Racetrack
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Tuesday, June
29, 2010 Lunch Meeting
Material
Trade-offs in Designing Electronic Packages
Material selections
for high frequency applications in transmit/receive (T/R) modules used in modern
phased array radar systems is crucial to military programs in terms of cost and
performance. Module design approach and fabrication methods minimize yield loss
in manufacturing. HTCC, LTCC, and organic material comparisons will be presented
along with a case study describing the T/R module design process using advanced
modeling and simulation tools.
About the presenter: Paul Garland received his BS is System
Science from the University of California San Diego and has over 20 years
experience in building and designing electronic packages. He has worked at
Kyocera since 1984 and has had a variety of responsibility from manufacturing to
R&D. In 1994, he helped begin the High Frequency Department and he is now a
part of the New Product Development Department where he specializes in high
speed and high frequency packaging. He has several patents related to the
packaging field and is currently the Vice Chair of the MTT-12
group.
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May 5th, 2010 Lunch Meeting
Program 1 : Starts 12:00 PM
Acoustic Pulse Recognition (APR)
Acoustic
Pulse Recognition (APR) recognizes the unique sound produced when a
stylus strikes a glass screen by utilizing piezoelectric sensors and
a database of sound fingerprints keyed to screen locations. APR is
more energy-efficient, more durable and more versatile than other
technologies. New approaches permit touch-and-drag operations.
Henry
D'Souza ~ ELO TOUCHSYSTEMS'S (A TYCO ELECTRONICS
CO.)
Henry
D'Souza holds a BSEE from Western Michigan University '82 and an MEE
from Rice '86. He is currently a Fellow at Elo TouchSystems which is
part of Tyco Electronics where he is primarily responsible for their
Acoustic Pulse Recognition (APR) technology, ongoing Resistive
Gesture Technology development as well as new applicable inventions.
He has over 27 years of experience in analog, digital,
optical/ophthalmic and color engineering at TI, Compaq, EyeSys
Technologies, HP and Tyco Electronics. He has worked on the
development of computers, displays, ophthalmic Instruments, photo
printers and most recently touch screens.
Program 2 : Starts 1:00 PM
ENEPIG NI/PD/GOLD A FINISH WHOSE TIME HAS COME
The
RoHS requirements of lead free has made it necessary once again to
revisit all available surface finish options. Most existing surface
finishes transitioned reasonably well into RoHS compliant assembly.
Electroless Nickel / electroless Palladium / immersion gold ENEPIG
has again come under close scrutiny, as the industry evaluated its
capabilities using lead-free assembly conditions. ENEPIG was unique
in the fact that it formed a robust, higher strength solder joint
with SAC 305 LF alloy, as compared to the solder joint formed with
eutectic solder. Electroless Nickel / electroless Palladium /
immersion gold ENEPIG is sometimes referred to as the Universal
finish, because of the versatility of its applications. ENEPIG is
suitable for soldering, gold wire bonding, aluminum wire bonding, and
contact resistance. ENEPIG is formed by the sequential deposition of
electroless Ni (120 - 240 micro inches) followed by 2 - 6 micro
inches of electroless Pd with an immersion gold flash (1 - 2 micro
inches) on top.
George
Milad ~ UYEMURA INTERNATIONAL CORPORATION
George
Milad has 30 years of experience in PWB manufacturing, and is the
National Accounts Manager for Technology at Uyemura International
Corporation. He is the author of the chapters on "Plating"
and "Surface Finishing" in Clyde Coomb's "Printed
Circuit handbook" Fifth Edition, 2001. He is the recipient of
the IPC 2009 President's award.
Program 3 : Starts 2:00 PM
CONNECTING
WITH LARGE PRIME GOVERNMENT CONTRACTORS
Federal Government
Contracting Process presented by one of the leading experts. Examples
will
illustrate revenue growth opportunities for even smaller businesses when
connected to large prime contractors. Large prime contractors will also
find
this interesting to uncover new channels for qualified small businesses
to sub
contract portions of larger contracts. Information will also be
presented on CA
government contracting $s awarded by industry, etc...
Alex
Krutz ~ GOVCOM MANAGEMENT & INTEGRATED SOLUTIONS (GCMIS)
Alex Krutz
is the President and founder of GovCom Management & Integrated
Solutions
(GCMIS). This company promotes revenue growth through Government
contract
acquisition and establishing sub-contracting relationships with large
commercial companies. GCMIS also improves client management systems by
implementing new operational and supply chain strategies.
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April,
2010
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Tuesday, March 23, 2010
Program:
Mr. Ping Huang of ECRI Microelectronics (ECRIM) will address high-speed optical module R & D with an emphasis on sealing & brazing of stainless steel and AuSn soldering for high-speed package components. Samples of the latest optical packages will be showcased during the presentation.
ECRIM manufactures and supplies optical module packages to optical packaging companies supporting optical communications and networks.
ECRIM has more than 40 years experience in the development and manufacturing of microelectronics & packages.
Mr. Ping Huang is the Director of ECRIM Package Department. His two prior positions at ECRIM include the Head of the Package Design Department and a Design Engineer of Package Architecture.
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Tuesday, February 23, 2010 Lunch Meeting
Program:
Solar
Energy to the Common
Lonnie
Morris, Vice President of Business Development of Advanced Technology
NovaSpectra
Abstract: Solar cell
implementations today are primarily based on low-cost manufacturing of
semiconductor material that only result in typically 13%-17% efficiency leaving
the vast majority of the sun’s energy wasted as heat. Increasing the efficiency
of solar cells with epitaxial growth of multiple materials has demonstrated up
to approximately 39% using three materials. This approach is typically cost
prohibitive without government subsidies.
Adding additional
materials through epitaxial growth to capture more energy has proven to be
difficult and expensive to increase efficiency.
NovaSpectra has
developed an approach to combine six materials for a low cost manufacturing
approach for an efficiency over 50%. This process does not require the
epitaxial growth of materials with similar lattice bands. NovaSpecta has
developed a technique that includes micro-concentrators, thousands of P-N
junctions, with extremely small (2mm x 2mm) solar cells that capture the full
spectrum of energy from the sun with over 50% efficiency and greater.
Bio: Lonnie Morris is the
Vice President of Business Development of Advanced Technology for NovaSpectra.
He has over 20 years in the aerospace industry primarily as Program Manager and
Business Development of Advanced Technology. He received BSEE from
Tuesday, January 26, 2010 Lunch Meeting
Program:
Hewlett Packard
“Disrupting the Printing Ecosystem.” Hewlett-Packard has a long history of utilizing innovative MEMS technology in its Ink Jet print systems. With the release of its fourth generation MEMS-based inkjet print heads and innovative pigment and latex inks, HP is leading the analog to digital conversion in printing markets.
Presenter Bio: Eric Wiesner is the R&D Director of Hewlett-Packard’s Media Supplies and Solutions Division. He oversees the development of a broad portfolio of innovative printing substrates that supports HP’s printing business. Eric has spent the majority of his twenty-five years with HP in both R&D and manufacturing leadership roles. He has helped to bring multiple inkjet print head and ink systems to market including those found in the Graphics, Small/Medium Business, and Enterprise markets.
Eric holds a Bachelor of Science degree in Mechanical Engineering from the University of Texas at Austin .