Summer Social at the Del Mar Racetrack

Sunday, July 25th, 2010, 2:00 at El Palio Restaurant. Your San Diego Joint Chapters of ACerS & IMAPS held its summer social event at the Del Mar Thoroughbred Club's El Palio Restaurant on the 6th floor.  Those brave enough to wager had smiles ear to ear.  All had a good time at this Sold Out Event.

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Tuesday, June 29, 2010 Lunch Meeting

 

Host - Kyocera America, Inc. 
Sponsor - Torrey Hills Technology

Material Trade-offs in Designing Electronic Packages

 

Material selections for high frequency applications in transmit/receive (T/R) modules used in modern phased array radar systems is crucial to military programs in terms of cost and performance. Module design approach and fabrication methods minimize yield loss in manufacturing. HTCC, LTCC, and organic material comparisons will be presented along with a case study describing the T/R module design process using advanced modeling and simulation tools.

About the presenter:  Paul Garland received his BS is System Science from the University of California San Diego and has over 20 years experience in building and designing electronic packages.  He has worked at Kyocera since 1984 and has had a variety of responsibility from manufacturing to R&D.  In 1994, he helped begin the High Frequency Department and he is now a part of the New Product Development Department where he specializes in high speed and high frequency packaging.  He has several patents related to the packaging field and is currently the Vice Chair of the MTT-12 group. 

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May 5th, 2010 Lunch Meeting

Del Mar Electronics and Design Show

Program 1 :  Starts 12:00 PM

Acoustic Pulse Recognition (APR)

Acoustic Pulse Recognition (APR) recognizes the unique sound produced when a stylus strikes a glass screen by utilizing piezoelectric sensors and a database of sound fingerprints keyed to screen locations. APR is more energy-efficient, more durable and more versatile than other technologies. New approaches permit touch-and-drag operations.

Henry D'Souza ~ ELO TOUCHSYSTEMS'S (A TYCO ELECTRONICS CO.)

Henry D'Souza holds a BSEE from Western Michigan University '82 and an MEE from Rice '86. He is currently a Fellow at Elo TouchSystems which is part of Tyco Electronics where he is primarily responsible for their Acoustic Pulse Recognition (APR) technology, ongoing Resistive Gesture Technology development as well as new applicable inventions. He has over 27 years of experience in analog, digital, optical/ophthalmic and color engineering at TI, Compaq, EyeSys Technologies, HP and Tyco Electronics.  He has worked on the development of computers, displays, ophthalmic Instruments, photo printers and most recently touch screens.

Program 2 : Starts 1:00 PM

ENEPIG NI/PD/GOLD A FINISH WHOSE TIME HAS COME

The RoHS requirements of lead free has made it necessary once again to revisit all available surface finish options. Most existing surface finishes transitioned reasonably well into RoHS compliant assembly. Electroless Nickel / electroless Palladium / immersion gold ENEPIG has again come under close scrutiny, as the industry evaluated its capabilities using lead-free assembly conditions. ENEPIG was unique in the fact that it formed a robust, higher strength solder joint with SAC 305 LF alloy, as compared to the solder joint formed with eutectic solder. Electroless Nickel / electroless Palladium / immersion gold ENEPIG is sometimes referred to as the Universal finish, because of the versatility of its applications. ENEPIG is suitable for soldering, gold wire bonding, aluminum wire bonding, and contact resistance. ENEPIG is formed by the sequential deposition of electroless Ni (120 - 240 micro inches) followed by 2 - 6 micro inches of electroless Pd with an immersion gold flash (1 - 2 micro inches) on top.

George Milad ~ UYEMURA INTERNATIONAL CORPORATION

George Milad has 30 years of experience in PWB manufacturing, and is the National Accounts Manager for Technology at Uyemura International Corporation. He is the author of the chapters on "Plating" and "Surface Finishing" in Clyde Coomb's "Printed Circuit handbook" Fifth Edition, 2001. He is the recipient of the IPC 2009 President's award.

Program 3 :  Starts 2:00 PM

CONNECTING WITH LARGE PRIME GOVERNMENT CONTRACTORS

Federal Government Contracting Process presented by one of the leading experts. Examples will illustrate revenue growth opportunities for even smaller businesses when connected to large prime contractors. Large prime contractors will also find this interesting to uncover new channels for qualified small businesses to sub contract portions of larger contracts. Information will also be presented on CA government contracting $s awarded by industry, etc...

Alex Krutz ~ GOVCOM MANAGEMENT & INTEGRATED SOLUTIONS (GCMIS)

Alex Krutz is the President and founder of GovCom Management & Integrated Solutions (GCMIS). This company promotes revenue growth through Government contract acquisition and establishing sub-contracting relationships with large commercial companies. GCMIS also improves client management systems by implementing new operational and supply chain strategies.

 

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April, 2010

University of San Diego

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Tuesday, March 23, 2010

Technical presentation, networking, & dinner.

Program:

 

Mr. Ping Huang of ECRI Microelectronics (ECRIM) will address high-speed optical module R & D with an emphasis on sealing & brazing of stainless steel and AuSn soldering for high-speed package components.  Samples of the latest optical packages will be showcased during the presentation.

 

ECRIM manufactures and supplies optical module packages to optical packaging companies supporting optical communications and networks.

ECRIM has more than 40 years experience in the development and manufacturing of microelectronics & packages.   

 

Mr. Ping Huang is the Director of ECRIM Package Department.  His two prior positions at ECRIM include the Head of the Package Design Department and a Design Engineer of Package Architecture.

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Tuesday, February 23, 2010  Lunch Meeting

 

Program:

 

Solar Energy to the Common Man. 

Lonnie Morris, Vice President of Business Development of Advanced Technology

NovaSpectra

 

Abstract: Solar cell implementations today are primarily based on low-cost manufacturing of semiconductor material that only result in typically 13%-17% efficiency leaving the vast majority of the sun’s energy wasted as heat. Increasing the efficiency of solar cells with epitaxial growth of multiple materials has demonstrated up to approximately 39% using three materials.  This approach is typically cost prohibitive without government subsidies. 

Adding additional materials through epitaxial growth to capture more energy has proven to be difficult and expensive to increase efficiency. 

 

NovaSpectra has developed an approach to combine six materials for a low cost manufacturing approach for an efficiency over 50%.  This process does not require the epitaxial growth of materials with similar lattice bands.  NovaSpecta has developed a technique that includes micro-concentrators, thousands of  P-N junctions, with extremely small (2mm x 2mm) solar cells that capture the full spectrum of energy from the sun with over 50% efficiency and greater.

 

Bio: Lonnie Morris is the Vice President of Business Development of Advanced Technology for NovaSpectra.  He has over 20 years in the aerospace industry primarily as Program Manager and Business Development of Advanced Technology.  He received BSEE from University of South Florida.