Lunch & Learn - ONSHORING DILEMMA - Challenges in Toolset Deployment for Domestic OSAT's Advance Packaging Operations in the US with Rey Alvarado
The Details:
This tutorial outlines the key activities involved in bringing up new tools, from selection to qualification, using a hypothetical scenario of a start-up OSAT company establishing operations in the U.S. Beyond equipment and staffing, defining the process baseline for specific semiconductor applications is a critical challenge. This PDC course will look at milestones on all Tool Buyoff process once a domestic OSAT facility has decided what equipment to purchase and review how to undertake process baselining definition. It will look at the different tool sets used for advance packaging process of the assembly line - What it takes to Qualify the tools, the materials and the overall process required to run the particular tool sets and materials. It will also present case scenarios of what type of challenges a given US start-up company will have to confront compared to other overseas OSAT companies which have established their own Legacy.
Date: 11/04/2025
Time: 11:45AM-1:00pm
Location: AI Technologies
6555 Nancy Ridge Dr
Suite #200
San Diego, CA 92131
- $25 for members, $30 for non-members, FREE for students with ID. Register HERE. Includes lunch! Please invite your friends and students - we always welcome new faces
We look forward to seeing you there!
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2019 Technical Presentations:
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- Lunch & Learn Speaker Session
2018 Technical Presentations:
- Precise Characterization of Multipin Connectors - Enow Tanjong
- Microscale Universal Sensor System (MUSS) - Dr. Visarath In
- Precise High-Thoroughput Underfill Dispense In Chip-On-Wafer Packaging - Hanzhuang “Hannah” Liang, PhD
- High-Frequency Characterization of Chip Package Substrates - Professor Ege Engin (SDSU Dept. of Electrical & Computer Engineering)
2017 Technical Presentations:
2016 Technical Presentations:
- TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
- Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
- Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
- How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
- Download a copy of Ken's presentation HERE
- New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies
2015 Technical Presentations:
- Nanofabricated Electronic Components - Carl Edwards, Space Micro
- FOWLP Technology and Application Space - Beth Keser, Qualcomm
- Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
- Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
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- CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
- Trends in RF Reliability Assessment - Roland Shaw, Accel-RF
2014 Technical Presentations:
- Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
- Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
- Download a copy of Tim's presentation HERE
- SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
- Download a copy of Rich's presentation HERE
- Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
- Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies
2013 Technical Presentations:
- Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
- Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
- Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine