Events

Abstract:
Low dielectric loss factor polymers are a key technology for 5G millimeter wave technology.  Specifically, for antenna-in-package (AiP) the dielectric properties are crucial to performance. The presentation will cover how the dielectric constant and dielectric loss factor influence signal speed and antenna gain. Package examples will be provided showing how for 5G mobile applications, the antennas will be integrated into the package. 

Register HERE

Logistics:

Date: May 19, 2023

Time: 12:00pm - 1:00pm

Location: EMD Performance Materials

6555 Nancy Ridge Road, Suite 200, San Diego, CA 92123

​

2020 Technical Presentations:

• AI Platform - Hardware and Software Integration for Precise Maneuverability - Shield Al's Mr. Mark White, Principle Engineer
  
• ​​Evolution of mmWave, Semiconductors, Antennae/interfaces, eWLB, to 60GHz BGA derives, and more... - Vubiq Networks, Mike Pettus, Founder & CTO
  

2019 Technical Presentations:​

• High Efficiency RF/Microwave Power Amplifiers and Transmitters for 5G Communication - Ophir RF, Ramon Beltran, PhD
• DLP 3D Printing for Biomedical Applications - Dr. Wei Zhu, Allegro 3D
• Lunch & Learn Speaker Session
  

2018 Technical Presentations:​

• ​Precise Characterization of Multipin Connectors - ​Enow Tanjong
  
• Microscale Universal Sensor System (MUSS) - ​Dr. Visarath In
• Precise High-Thoroughput Underfill Dispense In Chip-On-Wafer Packaging - ​​Hanzhuang “Hannah” Liang, PhD
• High-Frequency Characterization of Chip Package Substrates - Professor Ege Engin (SDSU Dept. of Electrical & Computer Engineering)
  

2017 Technical Presentations:

• CPI & CBI Risks to FOWLP - Mark Nakamoto, Qualcomm
• RDL Multilayer Metallization Approaches for Through Glass Via Technology - Dr. Rouppen Keusseyan, SAMTEC
• James Webb Space Telescope: Parts, Materials, and Processes - Dr. Michael Vernoy, Northrop Grumman Aerospace Systems
• Intellectual Property Rights - An Edge to Monetize - Kam Li, Procopio
  
  • Download a copy of the presentation HERE​

2016 Technical Presentations:

• TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
• Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
  
• Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
  
• How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
  
  • Download a copy of Ken's presentation HERE
    
• New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies

2015 Technical Presentations:

• Nanofabricated Electronic Components - Carl Edwards, Space Micro
  
• FOWLP Technology and Application Space - Beth Keser, Qualcomm
  
• Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
  
• Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
  
• Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC
  
• CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
  
• Trends in RF Reliability Assessment - Roland Shaw, Accel-RF

2014 Technical Presentations:

• Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
  
• Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
  
  • Download a copy of Tim's presentation HERE
    
• SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
  
  • Download a copy of Rich's presentation HERE
    
• Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
  
• Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies

2013 Technical Presentations:

• Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
  
• Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
  
• Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine