Events

Join your friends of the San Diego Joint Chapters of IMAPS & ACerS for our annual winter social at Filippi’s! The room is reserved, now all we need is YOU!
*Space is limited - please RSVP, ASAP.

Details:

• Date: Thursday December 5th from 5:30pm-8:30pm
• Location: Filippi's Pizza Grotto Scripps Ranch, 9969 Mira Mesa Blvd, San Diego, CA 92131
• $20 - general admission
• Students - complimentary admission
• Includes food & 2 drinks
• Please feel free to invite your friends - we always welcome new faces!

Link to purchase tickets HERE

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2020 Technical Presentations:

• AI Platform - Hardware and Software Integration for Precise Maneuverability - Shield Al's Mr. Mark White, Principle Engineer
  
• ​​Evolution of mmWave, Semiconductors, Antennae/interfaces, eWLB, to 60GHz BGA derives, and more... - Vubiq Networks, Mike Pettus, Founder & CTO
  

2019 Technical Presentations:​

• High Efficiency RF/Microwave Power Amplifiers and Transmitters for 5G Communication - Ophir RF, Ramon Beltran, PhD
• DLP 3D Printing for Biomedical Applications - Dr. Wei Zhu, Allegro 3D
• Lunch & Learn Speaker Session
  

2018 Technical Presentations:​

• ​Precise Characterization of Multipin Connectors - ​Enow Tanjong
  
• Microscale Universal Sensor System (MUSS) - ​Dr. Visarath In
• Precise High-Thoroughput Underfill Dispense In Chip-On-Wafer Packaging - ​​Hanzhuang “Hannah” Liang, PhD
• High-Frequency Characterization of Chip Package Substrates - Professor Ege Engin (SDSU Dept. of Electrical & Computer Engineering)
  

2017 Technical Presentations:

• CPI & CBI Risks to FOWLP - Mark Nakamoto, Qualcomm
• RDL Multilayer Metallization Approaches for Through Glass Via Technology - Dr. Rouppen Keusseyan, SAMTEC
• James Webb Space Telescope: Parts, Materials, and Processes - Dr. Michael Vernoy, Northrop Grumman Aerospace Systems
• Intellectual Property Rights - An Edge to Monetize - Kam Li, Procopio
  
  • Download a copy of the presentation HERE​

2016 Technical Presentations:

• TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
• Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
  
• Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
  
• How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
  
  • Download a copy of Ken's presentation HERE
    
• New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies

2015 Technical Presentations:

• Nanofabricated Electronic Components - Carl Edwards, Space Micro
  
• FOWLP Technology and Application Space - Beth Keser, Qualcomm
  
• Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
  
• Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
  
• Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC
  
• CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
  
• Trends in RF Reliability Assessment - Roland Shaw, Accel-RF

2014 Technical Presentations:

• Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
  
• Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
  
  • Download a copy of Tim's presentation HERE
    
• SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
  
  • Download a copy of Rich's presentation HERE
    
• Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
  
• Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies

2013 Technical Presentations:

• Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
  
• Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
  
• Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine