Events

Lunch & Learn with Dr. Jeff Gotro

Polymers for 5G Packaging Applications

The Details:

The presentation will cover the key polymer properties for advanced 5G packaging applications. Applications such as antenna-in-package and low loss packaging substrates require polymers and polymer composites with low dielectric loss factor (Df). The emergence of high frequencies used in 5G mobile communications in the 24-77 Ghz range requires polymer dielectrics with extremely low Df in the range of 0.002. The presentation will discuss strategies to obtain low dielectric loss factors and highlight commercially available materials.

Date: 09/09/2026

Time: 11:45am- 1:00pm

Location:

AI Technology (Formerly EMD Performance Materials)

6555 Nancy Ridge Dr.

San Diego, CA 92121

Register HERE

$25 members / $30 non-members / Free for students with ID (Includes lunch)

Please invite your friends and students - we always welcome new faces.

We look forward to seeing you there!

Speaker bio: Dr. Jeff Gotro has over forty years’ experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell, National Starch Electronic Materials, and InnoCentrix, LLC. He has published 66 technical papers and 6 book chapters in the field of polymeric materials for advanced electronic packaging applications, holds 15 issued US patents, and has 4 patents pending. Jeff is a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) and was awarded the IMAPS John A. Wagnon Jr. Technical Achievement Award in 2014 for his numerous technical contributions relating to polymers used in electronic packaging. Jeff holds a B.S. in Mechanical Engineering/Materials Science from Marquette University and a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science.

QP Technologies: Meeting Sponsor

QP Technologies, a division of Promex Industries, provides U.S.-based semiconductor assembly and packaging services for prototype and volume production. Its capabilities include die attach, wire bonding, flip chip, stacked die, wafer preparation, multi-chip modules, system-in-package assembly, substrate development, and custom IC packaging. QP Technologies supports aerospace and defense, medical, automotive, industrial, power semiconductor, compound semiconductor, and commercial applications. With extensive engineering and manufacturing expertise, QP Technologies delivers customized solutions, including quick-turn assembly, for complex semiconductor packaging requirements.

2026 Technical Presentations:

• An Introduction to RF Power Amplifier Design - Dr. Ramon Beltran, PhD
• Wafer-Level Packaging Keeps Evolving: Insights from Recent Teardowns - Trevor Yancey, Senior Analyst

2025 Technical Presentations:

• Onshoring Dilemma- Rey Alvarado, SCIFI Consulting

2020 Technical Presentations:

• AI Platform - Hardware and Software Integration for Precise Maneuverability - Shield Al's Mr. Mark White, Principle Engineer
  
• ​​Evolution of mmWave, Semiconductors, Antennae/interfaces, eWLB, to 60GHz BGA derives, and more... - Vubiq Networks, Mike Pettus, Founder & CTO
  

2019 Technical Presentations:​

• High Efficiency RF/Microwave Power Amplifiers and Transmitters for 5G Communication - Ophir RF, Ramon Beltran, PhD
• DLP 3D Printing for Biomedical Applications - Dr. Wei Zhu, Allegro 3D
• Lunch & Learn Speaker Session
  

2018 Technical Presentations:​

• ​Precise Characterization of Multipin Connectors - ​Enow Tanjong
  
• Microscale Universal Sensor System (MUSS) - ​Dr. Visarath In
• Precise High-Thoroughput Underfill Dispense In Chip-On-Wafer Packaging - ​​Hanzhuang “Hannah” Liang, PhD
• High-Frequency Characterization of Chip Package Substrates - Professor Ege Engin (SDSU Dept. of Electrical & Computer Engineering)
  

2017 Technical Presentations:

• CPI & CBI Risks to FOWLP - Mark Nakamoto, Qualcomm
• RDL Multilayer Metallization Approaches for Through Glass Via Technology - Dr. Rouppen Keusseyan, SAMTEC
• James Webb Space Telescope: Parts, Materials, and Processes - Dr. Michael Vernoy, Northrop Grumman Aerospace Systems
• Intellectual Property Rights - An Edge to Monetize - Kam Li, Procopio
  
  • Download a copy of the presentation HERE​

2016 Technical Presentations:

• TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
• Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
  
• Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
  
• How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
  
  • Download a copy of Ken's presentation HERE
    
• New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies

2015 Technical Presentations:

• Nanofabricated Electronic Components - Carl Edwards, Space Micro
  
• FOWLP Technology and Application Space - Beth Keser, Qualcomm
  
• Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
  
• Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
  
• Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC
  
• CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
  
• Trends in RF Reliability Assessment - Roland Shaw, Accel-RF

2014 Technical Presentations:

• Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
  
• Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
  
  • Download a copy of Tim's presentation HERE
    
• SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
  
  • Download a copy of Rich's presentation HERE
    
• Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
  
• Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies

2013 Technical Presentations:

• Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
  
• Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
  
• Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine